Gelonghui, April 26 | TSMC (TSM.US) rose 1.3% to US$138.36 before the market opened.
According to the news, TSMC’s system-level wafer technology will usher in a major breakthrough. The company said that the chip stacked version using CoWoS technology is expected to be ready in 2027. It will integrate SoIC, HBM and other components to create a powerful and comparable computing power Data center server racks. Or even entire server wafer level systems.
TSMC rose more than 1% before the market opened, system-level wafer technology will usher in a major breakthrough
Gelonghui April 26 | TSMC (TSM.US) rose 1.3% to US$138.36 before the market opened.
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